Superior Heat Dissipation Aluminum Alloy Coils for Electronics Applications
Product Specifications
| Type | Aluminum alloy coil |
| Thickness | 0.30-2.0mm |
| Alloy | 5052/6061/6013/7075 |
| Temper | H32/T6 |
| Trade terms | CIF, CNF, FOB, EXW |
Aluminum is the gold standard for electronics housings, offering unmatched advantages in lightweight construction, thermal management, manufacturability, and cost-effectiveness.
Our Manufacturing Capabilities
- Standardized processes enhance efficiency, reduce errors, and boost productivity
- Optimized work environment fosters positive attitudes and team cohesion
Advanced Production Facilities
All melting and holding furnaces supplied by GAUTSCHI (Switzerland)
1+1+4 and 1+5 hot rolling mills from SMS Group (Germany)
6 sets of cold rolling mills from SMS Group (Germany)
- World-class equipment ensures consistent product quality
- Specialized in high-quality aluminum alloy coils (1050, 1060, 1100, 3003, 3004, 3104, 5052, 6061)
- Streamlined internal management for efficient production
Automatic Aluminum Coil Wrapping System
- Reduced manual labor with faster, more consistent packaging
- Precision control for uniform wrapping results
- Secure packaging for safe transportation
Automated Three-dimensional Warehouse
- Smart Storage: Automatically handles high-temperature coils with temperature monitoring
- Automated Transport: Intelligent routing for coil transport based on production needs
- Flexible Handling: Efficient delivery to next production stage
Secure Ocean Shipping
- Cushioning materials and specialized lashing straps prevent movement
- Non-slip wooden blocks under each coil for stability
- Waterproof packaging with desiccants for moisture protection
Alloy Specifications and Applications
| Alloy | Temper | Typical Use Cases |
| 5052-H32 | H32 | Laptop bases, smart speakers |
| 6061-T6 | T6 | Premium phone frames, server chassis |
| 7075-T6 | T6 | Rugged/military devices |
| 6013-T6 | T6 | Unibody metal designs |
Key Advantages for Electronics Applications
Optimal Strength-to-Weight Ratio
- Ultra-light (2.7g/cm³ density - 1/3 of stainless steel) with high strength
- Enables 30%+ weight reduction in devices (e.g., 0.6mm thickness for laptop housings)
- Military-grade alloys like 7075-T6 (560MPa) for ruggedized equipment
Superior Thermal Management
- 237W/(m*K) thermal conductivity (200× better than plastics)
- Lowers chip temperatures by 8-12°C (verified in unibody designs)
- Compatible with advanced cooling solutions (vapor chamber welding)
EMI Shielding & Precision Manufacturing
- >60dB EMI shielding (at 1GHz) for 5G/wireless devices
- CNC machining precision: ±0.01mm tolerance (iPhone frame standard)
- Anodized hardness >500HV (sapphire-level scratch resistance)
Standard Thickness Selection Guide
| Product Type | Thickness (mm) | Application |
| Smartphones/Tablets | 0.4~0.8 | Slim design, CNC precision machining |
| Laptops | 0.6~1.2 | Structural support + thermal needs |
| Smart Watches/Earbuds | 0.3~0.6 | Ultra-lightweight, stamping |
| Servers/Routers | 1.0~2.0 | High strength + EMI shielding |
Industry Application Examples
- Apple MacBook: 6061-T6 CNC unibody (1.2mm thickness)
- Huawei Mate Phones: 6013-T6 + nano-ceramic coating (0.6mm)
